What can you simulate in EM3DS?		What cannot be simulated in EM3DS
MICs and MMICs PCBs and other planar structures Waveguide filters Planar antennas - currents and S parameters Vertical coax to pcb transitions Closed structures and top/bottom open structures Realistic metallization thickness and resistivity effects Full-wave analysis of FETs Lossy and frequency dependent materials Magnetic forces can be computed (MEMS) Bulk acoustic devices (coupled acoustic-EM analysis)		Angular Connectors Horizontal transitions from coax to pcb Complicated 3D structures Antenna radiation patterns Electromagnetic scattering problems Design for EMC

Intro

EM3DS is an integral equation, or MOM, frequency domain solver that is ideal for devices consisting in layers of dielectrics and metallic traces.
Includes a very fast 2.5 D simulator for quick estimation of parameters and a complete 3D (and still fast) simulator for the realistic modeling of metallization thickness and resistivity effects.
This EM solver is based on an unique approach - the Generalized Transverse Resonance Diffraction (GTRD).
Another unique feature of EM3DS is capacity to electromagnetically (full-wave) model FETs in linear regime by the use of distributed controlled current sources.
Also this is the only simulation tool that can perform coupled EM-acoustic analysis for bulk acoustic resonators.

Preprocessor

Definition of structures in EM3DS is done layer by layer in the main 2D graphical window - however there is a 3D visualiztion window to check the design (see examples below). EM3DS can also import layer structures in the BMP, DXF and GDSII formats from mechanical etc. drawing software.
All parameters, dimensions and material constants can be defined using mathematical expressions.
Various ports and port calibration can be defined, characteristic impedances for (un)coupled transmission lines are computed.

Solver

There are two different solvers included. A 2.5D MOM solver similar to other planar EM solvers and, the unique 3D solver. By using the proprietary Asymptotic Estimation Algorithm, wideband simulations are done very fast.

Postprocessor

EM3DS calculates and represents in 3D the current distribution, plots the frequency dependence of the S parameters, and computes a low frequency Spice equivalent circuit.
EM3DS can also export layer structures in the BMP, DXF and GDSII formats.


Integration with circuit/system simulators

Although it can be used efficiently as an independent simulation and design tool, EM3DS can also be integrated as the electromagnetic engine in AWR Microwave Office 6 suite.




Recommended applications

Any microwave and millimeter wave planar structure for which radiation pattern computation is not important:
MICs, MMICs, PCBs.
Simple metallic waveguide structures, transitions, dielectric resonators and guides.
Full-wave EM simulation of active devices in ICs
Bulk acoustic resonators.
RF MEMS


Pros:
Full 3D simulation
Fast and accurate simulations - faster than commercial FEM, FDTD or TLM based programs
Price - the most competitively priced simulation software on the market, as low as one fifth of the price of the leading EM CAD software.
Easily analyzes structures with thin metallic layers, the most difficult situations for programs based on FEM, FDTD, TLM.
Unique features: volumetric MOM, calculates the currents inside metals, full-wave analysis of FETs, coupled EM-acoustic analysis, MEMS.

Cons:
Limited to layered structures and a few other devices.
No radiation pattern computation (although radiative structures are simulated).


Download
Test drive EM3DS!
Download a free demo version with limited features (6MB) -->
Help and example files are included. Download the ziped pdf manual (3MB) -->

Or we can send you a fully functional trial version for a one month period -->

Contact us for pricing or more information: info@emintegrity.com